Electronics Panel

Surface Finishing – Polish / Texture

Surface finishing is a crucial step in electronics panel manufacturing, directly impacting both appearance and performance. Common treatments include polishing and texturing. Polishing enhances surface smoothness and gloss, while texturing creates patterned finishes that improve aesthetics and functional performance.

The Parting Line Design Of Electronics Panel

When designing electronics panel parting lines, we consider mold opening direction and demolding methods to ensure a clean appearance. Parting lines are placed in hidden or edge areas to avoid visible surfaces and maintain the product’s overall aesthetics. The red lines indicate the parting lines.

The Draft Angle Analysis Of Electronics Panel

We review the draft angle based on surface finish requirements. For lightly textured or yellowed surfaces, a draft angle of 0.5° or greater is recommended to improve surface quality, reduce molding defects, and ensure consistent appearance, durability, and production efficiency.

Slider & Lifter Design Of Electronics Panel

Mold sliders and ejector pins are key components in the design of injection molds and are critical to ensuring high-quality product molding. Sliders are used to form complex geometries in a mold that cannot be formed by simple opening and closing motions. Their design needs to be precise, and they are usually made of high-strength steel to withstand the stresses of the high-pressure injection molding process.

Ejector pins are used to push the product out of the mold after injection molding is complete. The number, position, and shape of the ejector pins need to be carefully designed according to the structure and size of the electronics panel product to ensure that no damage is caused to the product surface during the push-out process.

Sub-Insert Design

Sub-Insert design plays a vital role in plastic mold design, especially in the manufacture of products that require high precision and complex geometries. Inserts are part of the mold and can be separate components used to form specific product details or features. Picture1 of the blue line is parting line of cavity sub-insert. Picture 2 of the blue line is parting line of core sub insert. 

Ejector Design

Gate Type & Location & Size of Electronic Panel

YUDO hot runner system was converted to a cold runner system with sub gate. The gate size in this system is Ø1.8mm, which not only improves the manufacturing efficiency of the mold, but also significantly reduces the material waste and ensures the stability and consistency of the electronics panel quality.

By using a manifold gate, we can achieve more accurate injection molding to meet the needs of various complex shapes and high-precision requirements of parts production. In addition, the Ø1.8mm gate size design can effectively reduce the resistance to melt flow, improve molding cycle time, and further increase production efficiency.

The Problem Points of Electronics Panel

Picture 1:
The red shut-off surface has a 0.5° draft, making it prone to burn-in. We recommend increasing it to 3° to improve demolding, prevent defects, and enhance product quality. The blue surface shows an undercut and should be relieved for proper demolding.

Picture 2:
The highlighted small step may cause flash. Adding material to the blue surface will eliminate this step and improve mold filling and surface quality.

Picture 3:
To prevent flash at the parting line, we recommend appropriately relieving material on the blue surface to ensure proper mold contact and dimensional accuracy.

Picture 4:
To simplify the parting line, adjust the blue surface draft toward the cavity side and increase it to 3°, reducing mold complexity, cost, and flash risk.

Picture 5:
The boss inner hole is not concentric with the outer diameter, which may cause assembly issues and stress concentration. We recommend optimizing the design and machining accuracy to ensure proper concentricity and improve product performance and service life.

Picture 6:
Plastic material exists in the indicated area. To maintain structural stability, we recommend adjusting the screw position to keep the material thickness above 0.5 mm, ensuring sufficient strength, better material flow, and reduced risk of deformation or molding defects.

Picture 7:
The marked area is too thin (0.24 mm), increasing the risk of short shots. We recommend adjusting the red surface draft angle to increase the thickness to ≥0.5 mm, improving mold filling and overall part quality.

Electronics Panel Mold Trial

During the trial production of the electronics panel mold, we first conduct a comprehensive inspection to confirm that it meets the design specifications and is in optimal condition. We then select suitable materials and conduct small-lot injection molding tests, adjusting process parameters to optimize product quality. The prototype products undergo rigorous dimensional measurement and functional testing to ensure that they meet the high standards of our customers’ requirements.

Reasonable mold layout design is the basis for achieving high-quality injection molding. By optimizing various aspects such as cavity and core layout, gating system, ejector system, cooling system, parting surface and venting system, the working efficiency of the mold and the quality of the product can be improved. The mold layout design needs to take into account the shape, size, material properties and production requirements of the electronics panel, to achieve the best production results. Due to the electronics panel being too high, we suggest using the LOGO160 A8 injection machine.

Before delivery, we will fully maintain and clean the molds to make sure the surface of the molds are smooth and internal impurities. Then anti-shock material and protective padding are packed and put into wooden crates and labeled with model and quantity information.