EN
DE
Common Thermal Conductive and Structural Materials for Electronic Product Housings
The following is a table of commonly used thermal conductive and structural materials for electronic product housings, covering high thermal conductive materials, common structural plastics, and composite materials, to facilitate material selection in electronic product mold design.
Material Category |
Material Name |
Thermal Conductivity (W/m·K) |
Structural Properties |
Typical Applications |
|---|---|---|---|---|
| Metals | Aluminum Alloy | 150–235 | Lightweight, excellent thermal conductivity, good corrosion resistance | Laptop housings, LED light housings, 5G communication equipment |
| Magnesium Alloy | 70–100 | Ultra-lightweight, high strength, good damping properties | Mobile phone housings, camera housings | |
| Stainless Steel | 15–30 | High strength, good corrosion resistance, moderate thermal conductivity | High-end electronic enclosures, structural reinforcement | |
| Copper | 390–400 | Excellent thermal conductivity, heavy weight, high cost | Heat dissipation components, heat sinks | |
| Plastics | PC (Polycarbonate) | 0.19–0.22 | High impact resistance, good dimensional stability, flame-retardant options | Laptop shells, automotive electronic housings |
| ABS | 0.17–0.2 | Easy to mold, good surface finish, moderate cost | Consumer electronics housings, TV back covers | |
| PPS (Polyphenylene Sulfide) | 0.29–0.35 | High heat resistance, good chemical resistance, stable dimensions | Automotive electronics, high-temperature housings | |
| LCP (Liquid Crystal Polymer) | 0.2–0.35 | High precision molding, low thermal expansion, lightweight | 5G antenna components, connectors | |
| Ceramics | Aluminum Nitride (AlN) | 140–180 | Excellent thermal conductivity, electrical insulation, high strength | High-power electronic substrates, heat spreaders |
| Aluminum Oxide (Al₂O₃) | 20–35 | High hardness, electrical insulation, cost-effective | Sensor housings, high-temperature electronic components | |
| Silicon Nitride (Si₃N₄) | 30–90 | High strength, thermal shock resistance, electrical insulation | High-performance power electronics, automotive modules | |
| Composite Materials | Graphite Thermal Films | 150–500 (in-plane) | Ultra-thin, flexible, directional thermal conductivity | Smartphone backplates, flexible electronics |
| Carbon Fiber Reinforced Plastic (CFRP) | 5–10 | Lightweight, high strength, customizable thermal properties | Drone housings, aerospace electronics | |
| Metal Matrix Composites (MMC) | 150–250 | Balanced strength and thermal conductivity, low density | High-performance electronic housings, heat sinks |
Recommended Selection
- High-power electronic products (such as 5G base stations and LED lamps) → A combination of aluminum alloy/magnesium alloy and thermally conductive plastic is recommended.
- Lightweight portable devices (mobile phones and tablets) → PC + ABS or CFRP composite structures.
- Products with a high waterproof and dustproof rating (IP67 or higher) → Use PC or PA with good sealing properties and a thermally conductive coating.
Get In Touch
Our senior sales and technical engineers will answer you questions fast and efficient.